| 摘要 |
<p>PROBLEM TO BE SOLVED: To overcome such a problem that heat for melting a sealing material affects and deteriorates characteristics of an electronic part accommodated within a container. SOLUTION: A container for storing an electronic part comprises a insulating substrate 1 having a mounting portion where an electronic part 7 is mounted; a metal frame 2 which surrounds the mounting portion on the insulating substrate 1, forms a space where the electronic part 7 is accommodated therein, and is bonded to the insulating substrate 1 via a bonding member 5 with an external terminal 4, which is electrically connected to the electronic part 7, therebetween; and a metal lid 3 which is seam welded on a top face of the metal frame 2 to seal hermetically the electronic part 7, wherein the bonding member 5 comprises a glass material containing 30 to 40 weight percent of phosphorus pentoxide, 47 to 60 weight percent of tin protoxide, 1 to 6 weight percent of zinic oxide, 1 to 4 weight percent of aluminum oxide, and 1 to 3 weight percent of silicon oxide, and 16 to 45 weight percent of cordierite system compound which is externally added to the glass material as a filler.</p> |
