发明名称 Light emitting diode having an insulating substrate
摘要 An LED includes an insulating substrate; a buffer layer positioned on the insulating substrate; an n+-type contact layer positioned on the buffer layer, the contact layer having a first surface and a second surface; an n-type cladding layer positioned on the first surface of the n+-type contact layer; a light-emitting layer positioned on the n-type cladding layer; a p-type cladding layer positioned on the light-emitting layer; a p-type contact layer positioned on the p-type cladding layer; an n+-type reverse-tunneling layer positioned on the p-type contact layer; a p-type transparent ohmic contact electrode positioned on the n+-type reverse-tunneling layer; and an n-type transparent ohmic contact electrode positioned on the second surface of the n+-type contact layer. The p-type transparent ohmic contact electrode and the n-type transparent ohmic contact electrode are made of the same materials.
申请公布号 US2002179918(A1) 申请公布日期 2002.12.05
申请号 US20020063822 申请日期 2002.05.16
申请人 SUNG SHU-WEN;KU CHIN-FU;LIU CHIA-CHENG;HSIEH MIN-HSUN;HUANG CHAO-NIEN 发明人 SUNG SHU-WEN;KU CHIN-FU;LIU CHIA-CHENG;HSIEH MIN-HSUN;HUANG CHAO-NIEN
分类号 H01L21/28;H01L33/06;H01L33/12;H01L33/32;H01L33/42;(IPC1-7):H01L33/00 主分类号 H01L21/28
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