发明名称 Power semiconductor structure for causing a coolant to pass through to cool a power semiconductor element has a cooling element and a push-contact casing containing the power semiconductor element.
摘要 A cooling element (25) fits inside a push-contact casing (30) and between two power semiconductor elements like a thyristor (21) and a diode (22), which are brought into electrical contact by means of one or more copper blocks (28,29) fitted in the push-contact casing.
申请公布号 DE10125695(A1) 申请公布日期 2002.12.05
申请号 DE2001125695 申请日期 2001.05.25
申请人 EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO. KG 发明人 DORN, JOERG;KOHLER, HEINRICH;KELLNER-WERDEHAUSEN, UWE;FALCK, ELMAR;BARTHELMES, REINER;SCHMIDT, GERHARD;SCHULZE, HANS-JOACHIM;NIEDERNOSTHEIDE, FRANZ-JOSEF
分类号 H01L23/473;H01L25/11;(IPC1-7):H01L23/473;H01L23/04 主分类号 H01L23/473
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