Power semiconductor structure for causing a coolant to pass through to cool a power semiconductor element has a cooling element and a push-contact casing containing the power semiconductor element.
摘要
A cooling element (25) fits inside a push-contact casing (30) and between two power semiconductor elements like a thyristor (21) and a diode (22), which are brought into electrical contact by means of one or more copper blocks (28,29) fitted in the push-contact casing.
申请公布号
DE10125695(A1)
申请公布日期
2002.12.05
申请号
DE2001125695
申请日期
2001.05.25
申请人
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO. KG