发明名称 Semiconductor device and method for manufacturing the same
摘要 A Schottky diode includes a semiconductor substrate made of 4H-SiC, an epitaxially grown 4H-SiC layer, an ion implantation layer, a Schottky electrode, an ohmic electrode, and an insulative layer made of a thermal oxide film. The Schottky electrode and the insulative layer are not in contact with each other, with a gap being provided therebetween, whereby an altered layer does not occur. Therefore, it is possible to suppress the occurrence of a leak current.
申请公布号 US2002179909(A1) 申请公布日期 2002.12.05
申请号 US20020162503 申请日期 2002.06.04
申请人 UCHIDA MASAO;KITABATAKE MAKOTO;YOKOGAWA TOSHIYA;KUSUMOTO OSAMU;TAKAHASHI KUNIMASA;MIYANAGA RYOKO;YAMASHITA KENYA 发明人 UCHIDA MASAO;KITABATAKE MAKOTO;YOKOGAWA TOSHIYA;KUSUMOTO OSAMU;TAKAHASHI KUNIMASA;MIYANAGA RYOKO;YAMASHITA KENYA
分类号 H01L21/329;H01L29/24;H01L29/872;(IPC1-7):H01L29/04;H01L29/47;H01L29/812;H01L31/07 主分类号 H01L21/329
代理机构 代理人
主权项
地址
您可能感兴趣的专利