| 摘要 |
In soldering devices for soldering flat modules according to prior art, the solder container, subjected to the recess resulting from the solder waves produced, is provided with a cover for receiving an inert gas atmosphere. A gap is maintained between a respective solder wave and the cover, through which the inert gas is guided from the solder container along the solder waves. In order to compensate for pressure variations in the inert gas atmosphere, which may impair the geometry of the solder waves, said gap between the solder wave and the solder container must however have a certain minimum width, which encourages however the occurrence of turbulence which may lead to the inert gas atmosphere in the solder container mixing with the surrounding atmosphere containing oxygen. According to the invention, a cover provided for a solder container has closable openings through which the inert gas can escape from the region between the solder container and the cover, in the event of excess pressure. In order to close the openings, flaps are used for example, which, seen from the solder container, can be outwardly pivoted. As a result of the closable openings, the width of the gap between the solder wave and the cover is reduced, thus preventing turbulent flows.
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