| 摘要 |
The invention relates to a method for shielding an electric circuit created on a printed circuit board (1), which comprises at least the following steps: a. covering of the printed circuit board (1) with an electrically insulating material (4) in such a way that at least the electric circuit created on the printed circuit board (1) is covered with the electrically insulating material (4) and at least one earthed location (6) on the printed circuit board (1) is left uncovered; b. application of an electrically conductive material (5), which acts as a shield, to the electrically insulating material (4) in such a way that at least the circuit created on the printed circuit board is covered with the electrically insulating material (4), to which the electrically conductive shielding material (5) has been applied; c. contacting of the electrically conductive shielding material (5) with the earthed location(s) (6) of the printed circuit board (1). The invention also relates to a combination of a printed circuit board (1), on which at least one electric circuit is created, and at least one shield (3) for said circuit(s). In said combination, at least the electric circuit created on the printed circuit board is provided with a first covering (4) of an electrically insulating material. A second covering (5) of an electrically conductive shielding material is applied to the first covering (4) of electrically insulating material, on the side that faces away from the electric circuit and the second covering (5) of electrically conductive shielding material is contacted with at least one earthed location (6) of the printed circuit board (1).
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