Three-dimension multi-chip stack package technology

摘要

The present invention provides a structure and a method for multi-chip stack package. The present invention uses the liquid insulating epoxy to adhere and stack chips. The liquid insulating epoxy is filled the space between chips and metal wires bonded thereon and the liquid insulating epoxy is higher than the high of the arc of those metal wires, so it can increase the reliability of stacking and bonding process. The present invention can stack multi-chip (more than two) by controlling the arc height of the wire and the thickness of the chip. The present can easily perform by visible equipment and materials.