| 摘要 |
A circuit board of the present invention comprises a composite resin and a metal plate, and the metal plate forms circuit patterns. The metal plate is preferably made of copper or copper alloys having excellent heat conductivity. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a hardener. The metal plate is surface roughened or treated to reinforce the adhesion at least at one surface contacting with the composite resin. In the circuit board of the present invention, the composite resin fills spaces between the circuit patterns, and the composite resin composition and the metal plate form a plane at the side of the metal plate for mounting components. In the circuit board of the present invention, since the resin composition including the inorganic filler is also present in the spaces between circuit patterns of a metal plate, its heat dissipation characteristic is extremely high, and it is suited as a circuit board for electronic apparatus containing heat generating parts such as power circuit.
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