| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of correcting film thickness/film quality distribution and polishing shape distribution changing gently in a radius direction. SOLUTION: This wafer polishing device 10 is capable of continuously and gently changing a pressure distribution imparted to an outer peripheral part of the wafer W and a pressure distribution imparted to a center part of the wafer W, regarding a pressure distribution imparted to the wafer W. Namely, because an air dynamic pressure distribution continuously changing can be formed between a carrier 24 and a protective sheet 34, the rugged shape of the wafer W changing gently in the radius direction can be accurately and flatly polished. |
