发明名称 POLISHING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing device for making finishing accuracy of a workpiece high accurate and a polishing method using the device. SOLUTION: This device is constituted of a pair of lapping tape supplying/ winding means 64 and 65 for supplying a lapping tape 70 from a supply side and winding the supplied lapping tape 70, a lapping tape holding base 77 which is arranged between the pair of the lapping tape supplying/winding means 64 and 65 and finishes a lapping tape traveling surface with high accuracy, a lapping tape traveling and holding mechanism A for imparting tension to the lapping tape laid on the lapping tape holding base 77, a moving mechanism B holding the traveling and holding mechanism A and moving in a direction crossing the traveling direction of the lapping tape, and slide mechanisms 81, 82, 83, 84 and 85 having rotation means 78 and 80 for rotating the workpiece 44 in a state of the workpiece 44 abutted on the lapping tape 70 within the traveling and holding mechanism A.
申请公布号 JP2002346902(A) 申请公布日期 2002.12.04
申请号 JP20010155085 申请日期 2001.05.24
申请人 VICTOR CO OF JAPAN LTD 发明人 KOBAYASHI YASUKI;HIDAKA TAKATOSHI
分类号 B24B7/00;B24B21/00;B24B21/10;(IPC1-7):B24B21/00 主分类号 B24B7/00
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