Interconnection of circuit substrates on different planes in electronic module

摘要

An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44). During a solder screening process a solder paste is applied to the opening (56) of the second circuit substrate (44), and during a solder reflow operation the solder paste melts and a connection is formed between the first circuit substrate (40) and the second circuit substrate (44).