发明名称 Method for forming a capacitor of a semiconductor device
摘要 A capacitor having high capacitance using a silicon-containing conductive layer as a storage node, and a method for forming the same, are provided. The capacitor includes a storage node, an amorphous Al2O3 dielectric layer, and a plate node. The amorphous Al2O3 layer is formed by a method in which reactive vapor phase materials are supplied on the storage node, for example, an atomic layered deposition method. Also, the storage node is processed by rapid thermal nitridation before forming the amorphous Al2O3 layer. The amorphous Al2O3 layer is densified by annealing at approximately 850° C. after forming a plate node, to thereby realize the equivalent thickness of an oxide layer which approximates a theoretical value of 30 Å.
申请公布号 US6489214(B2) 申请公布日期 2002.12.03
申请号 US20010962327 申请日期 2001.09.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM YEONG-KWAN;PARK IN-SEON;LEE SANG-MIN;PARK CHANG-SOO
分类号 H01L27/04;H01L21/02;H01L21/314;H01L21/316;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01L27/04
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