| 摘要 |
A sealant composition comprising a curable epoxy-containing material, a thermoplastic polyamide component having a melting point lower than a curing temperature of the epoxy-containing material, and a curative for the epoxy-containing material. After curing of the epoxy-containing material, the sealant composition exhibits an elongation at -20° C. of at least 2. The sealant composition is capable of effectively sealing discontinuities while maintaining enough flexibility to absorb applied stress, thereby preventing the formation of defects in the sealant which permit the intrusion of dirt, moisture, and other undesirable substances.
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