发明名称 TRANSPARENT CONDUCTIVE LAYERED STRUCTURE AND METHOD OF PRODUCING THE SAME, AND COATING LIQUID FOR FORMING TRANSPARENT CONDUCTIVE LAYER USED IN PRODUCTION OF TRANSPARENT CONDUCTIVE LAYERED STRUCTURE AND METHOD OF PRODUCING THE SAME
摘要 The present invention relates to a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this substrate, used in, for instance, the front panel of CRT, etc., display devices. The main components of said transparent conductive layer are noble metal microparticles with a mean particle diameter of 1 to 100 nm, wherein the microparticles are made from gold and/or platinum and silver and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %, and a binder matrix. Moreover, the main components of the coating liquid used to form a transparent conductive layer in the production of a transparent conductive layered structure are solvent and noble metal-coated silver microparticles with a mean particle diameter of 1 to 100 nm dispersed in this solvent, wherein the surface of the silver microparticles is coated with gold or platinum only or a compound of gold and platinum and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %.
申请公布号 US6489029(B1) 申请公布日期 2002.12.03
申请号 US20020134469 申请日期 2002.04.30
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 KATO KENJI;YUKINOBU MASAYA
分类号 C09D5/24;H01J29/28;(IPC1-7):B32B17/06;H01B1/22 主分类号 C09D5/24
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