| 发明名称 |
Integrated circuit package having a substrate vent hole |
| 摘要 |
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
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| 申请公布号 |
US6490166(B1) |
申请公布日期 |
2002.12.03 |
| 申请号 |
US19990330373 |
申请日期 |
1999.06.11 |
| 申请人 |
INTEL CORPORATION |
发明人 |
RAMALINGAM SURESH;VODRAHALLI NAGESH;COSTELLO MICHAEL J.;LOKE MUN LEONG;MAHAJAN RAVI V. |
| 分类号 |
H01L21/60;H01L21/56;(IPC1-7):H01L21/00;H05K1/18 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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