| 摘要 |
PROBLEM TO BE SOLVED: To surely, efficiently, and precisely transfer only an electronic part to be transferred with no effect on other parts. SOLUTION: Electronic parts arrayed on a first substrate are selectively transferred onto a second substrate where an adhesive resin layer is formed. While a process residue of a previous process remains on an electronic part surface, a laser beam is projected to a rear surface side of a second substrate to selectively heat an adhesive resin layer on the second substrate, and the adhesive resin layer is cured o that an element to be transferred is bonded to the second substrate. When the laser beam is projected from the rear surface side of the substrate to heat the adhesive resin layer at that part, the adhesive resin layer at that heated part selectively provides adhesive power. By curing it, only the element to be transferred is selectively transferred onto the second substrate. Here, a process residue on the electronic part surface functions as a reactive material for the laser to efficiently convert the laser beam into heat. |
