| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is easy to handle, even if being formed thin, while semiconductor elements are formed thin to mount them at high density in the prior art, but base materials used for the semiconductor elements are brittle enough to break, thus making difficult handling in the thinned condition. SOLUTION: A semiconductor element 1 is mounted in a face-down manner on a surface of a printed board 5 with electrode posts 3 formed thereon, the electrode posts 3 and the element 1 are molded with a resin 4, and only the molded surface of the resin 4 is polished until the posts 3 appear on the surface. Thus, the semiconductor element is mounted by face-down mounting less in increase in the thickness on a flexible printed board and the polishing follows to realize a semiconductor device easy to handle, even if being formed thin. |
