| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer handling mechanism for a wafer processing apparatus of the same degree of an installing area and a manufacturing cost as those of a prior art without contaminating the wafer after processing. SOLUTION: The wafer handling mechanism 10 comprises a hand member 11 for placing the wafer to input and output the wafer and an arm member 16 for supporting the hand member to move the member in the wafer processing apparatus for processing the wafers 30, 31 such as silicon wafers or the like. The hand member has a first hand 11a for placing the forked wafer and a second hand 11b. |
