| 摘要 |
PROBLEM TO BE SOLVED: To provide a thick film multilayer board without continuity failure between upper and lower wiring layers, and a method of manufacturing the same. SOLUTION: After a connecting pad 62 is provided within a range A so as to have a uniform thickness in a first wiring layer forming step, a first insulator layer 40 is formed in a first insulator layer forming step while a whole non-opening portion 18 corresponding to a via hole 50 in a screen 14 are brought into contact with the connecting pad within the planar range A. Consequently, since a thick film insulating paste is applied while the whole non-opening portion 18 is brought into contact with the connecting pad 62, the thick film insulating paste is prevented from entering the inside of the outer periphery of the non-opening portion 18. Accordingly, since the via hole 50 provided in the first insulator layer 40 is formed in a predetermined size corresponding to the size of the non-opening portion 18, contact between a second wiring layer 42 formed on the first insulator layer 40 and a first wiring layer 38 via the connecting pad 62 can be ensured. |
