| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board which has a resin composition surely filled in through-holes enough to avoid undulation or irregularities on an interlayer resin insulation layer, when laminating the insulation layer after forming the through-holes. SOLUTION: The multilayer printed wiring board manufacturing method for forming a plurality of through-holes having a resin filled layer inside comprises a step (a) of forming a plurality of original through-holes having a conductive layer on their walls, a step (b) of filling part of the through-holes with a resin composition from one side thereof, a step (c) of filling those through-holes not filled with the resin composition in the step (b) with the resin composition once or more from the opposite side to that in step the (b), a step (d) of polishing the surface of the resin composition, and a step (e) of hardening the resin composition to form finished through-holes. |
