| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board mounting structure for LED chip that can suppress the amount of conductive material used. SOLUTION: The other end of a wire 20, one end of which is jointed to the surface electrode 36 of an LED chip 30 mounted on a wiring board 10, is jointed to the surface electrode 46 of another LED chip 40 mounted on a land 14b. In this way, the LED chip 30 can be caused to emit light, by making a current to flow to the chip 30 from the land 14b via the chip 40 and wire 20. Then, since the amount of the conductive material used can be suppressed, formation of plated layers on the lands of the board 10 can be dispensed with. |
