| 摘要 |
PROBLEM TO BE SOLVED: To provide a apparatus and a method for bonding which can prevent a positional deviation of a semiconductor device at the time of mounting the device on a semiconductor substrate. SOLUTION: One or more first suction ports 6 are provided on a mounting substrate 2 to fix the substrate 2 by vacuum suction on a stage 1. A second suction port 7 is also provided to fix the semiconductor device 3 by vacuum suction to mount on the substrate 2 via a through hole 4 provided at the substrate 2 at the stage 1. |
