发明名称 |
SEMICONDUCTOR DEVICE SEPARATION USING A PATTERNED LASER PROJECTION |
摘要 |
<heading lvl="0">Abstract of Disclosure</heading> A method for separating a semiconductor wafer into several thousand devices or die by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it. A mechanical separation process completes the separation when only a partial cut is achieved by the patterned laser projection. The die are then transferred to a grip ring for further processing.
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申请公布号 |
US2002177288(A1) |
申请公布日期 |
2002.11.28 |
申请号 |
US20020114099 |
申请日期 |
2002.04.02 |
申请人 |
BROWN MICHAEL G.;ELIASHEVICH IVAN;KARLICEK ROBERT F.;NERING JAMES E.;GOTTFRIED MARK |
发明人 |
BROWN MICHAEL G.;ELIASHEVICH IVAN;KARLICEK ROBERT F.;NERING JAMES E.;GOTTFRIED MARK |
分类号 |
B23K26/073;B23K26/40;H01L21/301;H01L21/302;H01L21/304;H01L21/46;H01L21/78;H01L33/00;(IPC1-7):H01L21/301 |
主分类号 |
B23K26/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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