DEVICE AND METHOD FOR ENCASING AN ELECTRONIC COMPONENT
摘要
The invention relates to a device (1) and to a method for encasing an electronic component (10). According to the invention, the device (1) comprises a sleeve (100) and a casting compound (200), whereby said casting compound (200) is hardened. The casting compound (200) is one that hardens at an accelerated rate when exposed to water molecules, and the sleeve (100) provides the water molecules.
申请公布号
WO0239487(A3)
申请公布日期
2002.11.28
申请号
WO2001DE03881
申请日期
2001.10.10
申请人
ROBERT BOSCH GMBH;JUST, BERNHARD;SPITZ, RICHARD;ENDRES, WOLFGANG;GOELZ, ALEXANDER
发明人
JUST, BERNHARD;SPITZ, RICHARD;ENDRES, WOLFGANG;GOELZ, ALEXANDER