| 摘要 |
PURPOSE: Provided is an epoxy resin composition for sealing semiconductor device, which comprises an epoxy resin having specific structure alone or a mixture thereof, and shows excellent heat resistance, crack resistance, and flexibility. CONSTITUTION: The epoxy resin composition consisting of an epoxy resin, a hardener, a hardening accelerator, a mineral filler, a flame retardant, and additives, is characterized by using 5-25 wt% of compound represented by formula 1 or 2(wherein n is an integer of 0-3), in addition to biphenyl epoxy, dicyclopentadiene-based epoxy resin(wherein the wt% is based on the composition), as the epoxy resin. The amount of the epoxy resin is 1-5 wt%.
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