| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which scarcely produces ionic impurities comprising e.g. halogen ions and is useful for the application to a printed wiring board, and a prepreg, a metal-clad laminate and a multilayer printed wiring board which are made by using the resin composition. SOLUTION: A resin composition for a printed wiring board, obtained by dissolving an epoxy resin composition consisting of 45 wt.% bisphenol A epoxy resin, 5 wt.% brominated bisphenol A epoxy resin, 45 wt.% bisphenol A resin and 5 wt.% 1,2-trimethylenebenzimidazole inγ-butyrolactone is infiltrated into a glass cloth, a copper foil of a thickness of 18μm is laminated on both sides thereof, and the laminate is heated to produce a double-side copper-clad laminate 110. The resin composition for a printed wiring board is used to form insulating layers 21, holes 71, a wiring layer 36a, a wiring layer 36b and uppermost solder resist layers 81, thus giving the multilayer printed wiring board 200. |
