| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor parts inspecting device which is constituted to prevent the plungers 16a of contact probes 16 from coming into contact with wiring 10b of semiconductor parts 10 form which solder balls 12 drop down. SOLUTION: A floating plate 14 through which through holes 14a are made to fit solder balls 12 and which is made of an insulating material is provided in parallel with the surface of the semiconductor parts 10, on which the solder balls 12 are arranged in a state where the plate 14 can be brought nearer to and separated further from the surface. Then a socket 18 in which contact probes 16 are provided to fit the through holes 14a is provided in a state where the socket 18 can be brought nearer to and separated from the parts 10. Each plunger 16a has a step section 16b having a smaller diameter on its front side, and the front end section of the plunger 16a is formed so that the section may be inserted into the corresponding through hole 14a, but the insertion is controlled by means of the step section 16b. This inspection device is constituted so that the front ends of the plungers 16a inserted into the through holes 14 may come into elastic contact with the solder balls 12, but may not come into elastic contact with the wiring 10b of the parts 10, when the floating plate 14 and socket 18 are most approximated to the parts 10.
|
