| 摘要 |
An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of aluminium, copper or the like by means of pressing along the lines perpendicular to its longitudinal direction and a phase changing member made of a mixture of paraffine and epoxy resin having alumina as a heat conductive filler dispersed therein and applied to a ceiling surface of the heat dissipation plate. When the heat sink and the electronic parts are soldered on a printed wiring board by heating of reflow soldering, the phase changing member made of the mixture of paraffine and epoxy resin is softened and partly moves downward by the action of gravity to abut the upper surface of the electronic part, then is solidified, thereby connecting the heat dissipation plate and the electronic part with each other. <IMAGE> |
