发明名称 |
Cooling arrangement for an electronic apparatus |
摘要 |
The invention provides an electronic apparatus having a metal core substrate including a metal plate (101), an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased. <IMAGE> |
申请公布号 |
EP1261028(A2) |
申请公布日期 |
2002.11.27 |
申请号 |
EP20020011192 |
申请日期 |
2002.05.21 |
申请人 |
HITACHI, LTD. |
发明人 |
HASEBE, TAKEHIKO;YOKOZUKA, TAKEHIDE;USHIFUSA, NOBUYUKI;HARADA, MASAHIDE;MATSUZAKI, EIJI;HOZOJI, HIROSHI |
分类号 |
H01L23/367;H01L23/498;H05K1/02;H05K1/05;H05K3/46 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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