Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies

摘要

Surface mount packages having pre-applied underfill thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.