| 摘要 |
PURPOSE: A method for manufacturing an electrode of a plasma display panel is provided to reduce the procedure and increase the adhesion of conductive plating material by eliminating an etching procedure in an electrolytic plating process. CONSTITUTION: A photoresist is coated on a glass substrate(50). The photoresist coated on a region where an electrode is to be formed is exposed and developed to be eliminated. A seed layer(54) is deposited on the glass substrate(50) and the photoresist. The remaining photoresist is eliminated. A conductive plating material is formed on the seed layer(54). The seed layer(54) is formed by sequentially depositing titanium, chrome, and copper. The conductive plating material is silver or copper. The thickness of the conductive plating material is determined by the amount of current and current applying time. |
