WAFER TRANSFER DEVICE FOR MECHANICAL CHEMICAL POLISHING EQUIPMENT

摘要

PURPOSE: A wafer transfer device for mechanical chemical polishing equipment is provided to reduce a standby time by forming absorbing sides on both sides of a blade. CONSTITUTION: A wafer transfer device is formed with a cylinder(10), a knuckle joint(20), and a blade(30). The cylinder(10) is horizontally rotated to a predetermined angle. The knuckle joint(20) is coupled with a lower end portion of the cylinder(10). The blade(30) is connected with the knuckle joint(20). The blade(30) is rotated to angle of ±180 degrees. A vacuum pressure is formed on an upper face and a lower face of the blade(30). Both sides of the blade(30) are used as absorbing sides since the vacuum pressure is formed on both sides of the blade(30). Accordingly, a wafer can be adhered on both sides of the blade(30).