| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming simply and in high reproducibility a conductive metal film which can be substituted for various plating films for various uses in an electronic component material field having process accuracy and reliability comparable to a plating film. SOLUTION: Extra-fine metal particles with average particle diameter of 100 nm or less are dispersed in an organic solvent with coating layer of an amine compound or the like capable of coordinate bonding with metal element, a coating film is formed with the use of paste-like dispersion liquid with the addition of organic acid anhydride or its derivative or organic acid or the like showing reactivity with the amine compound or the like of the coating layer, and then, is put under heat treatment at 250 deg.C or less, to manufacture a metal film with metal extra-fine particles densely sintered.
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