| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering resist composition which minimizes the problems of VOC(volatile organic compounds), improves productivity and gives a cured body excellent in water resistance (boiling water resistance), heat resistance, electrical characteristics, etc., and to provide a method for curing the composition. SOLUTION: The soldering resist composition is obtained by emulsifying (A) an epoxy-containing resin and (B) a photo-curable composition containing at least a resin (b1) containing one or more ethylenically unsaturated bonds and a carboxyl group in one molecule, a reactive monomer and/or a reactive prepolymer (b2) and a photoinitiator (b3) with an emulsifier and this emulsifier is a modifiable surfactant. |
