发明名称 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME AND CAP FOR ELECTRONIC COMPONENT PROTECTION, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To electromagnetically shield and protect an electronic component, without the need for a large volume and affecting the operation of the electronic component. SOLUTION: The electronic device 10 is provided with a mounting board 11 which comprises conductor patterns 12 exposed on one face 11a, with the electronic component 13 which is arranged, in such a way that a face 13a comprising connecting electrodes 14 faces one face 11a of the mounting board 11, in which the connecting electrodes 14 are electrically connected and mechanically bonded to the conductor patterns 12 on the mounting board 11; and a resin film 15 which covers the electronic component 13 and the mounting board 11, so as to come into close contact with the face 13b on the opposite side of the mounting board 11 of the electronic component 13 and which is bonded to the mounting board 11 and a conductive film 40, which covers the face on the opposite side of the electronic component 13 of the resin film 15. The conductive film 40 is electrically connected to grounding conductor parts 12G on the mounting board 11 via holes 37 which are mode in the resin film 15.
申请公布号 JP2002334954(A) 申请公布日期 2002.11.22
申请号 JP20010136994 申请日期 2001.05.08
申请人 TDK CORP 发明人 MORIYA BUNJI;HAYASHI SHINICHIRO;KUROSAWA FUMIKATSU;TAJIMA MORIKAZU
分类号 H01L23/28;H01L21/56;H03H3/08;H03H9/25;H05K9/00;(IPC1-7):H01L23/28 主分类号 H01L23/28
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