| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic material board which is used for manufacturing a chip electronic component composed of a plurality of elements, formed on a chip-type insulation board and shaped into a form which can be divided into many electronic components. SOLUTION: Breaking grooves A6 and A7 are engraved in a green sheet A0, which is set larger than a ceramic material board A which surrounds the ceramic material board A, through-holes A5 are bored in the ceramic material board A at positions located at the boundaries of insulating boards, then the green sheet A0 is baked at a high temperature, and the baked sheet A0 is broken along the breaking grooves A6 and A7 into the ceramic material board A.</p> |
