发明名称 |
EMI SHIELD AT BOARD LEVEL |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board designed to be coated with an electromagnetic conformal electromagnetic interference(EMI) preventing shield which is electrically continuity and grounded. SOLUTION: An EMI shield (100) comprises a dielectric coating (102) of low viscosity and high sticking characteristics which is directly applied to the surface of at least one region of a printed circuit board (304), acting as an insulating layer by sticking to the entire surface of the printed circuit board region; and a conductive coating (104) of low viscosity which is applied to at least the dielectric coating (102), so that the electromagnetic radiation generated at the printed circuit board (304) is prevented from radiating beyond itself. It directly sticks to the surface of the printed circuit board region for formal adaptation. |
申请公布号 |
JP2002335094(A) |
申请公布日期 |
2002.11.22 |
申请号 |
JP20020060233 |
申请日期 |
2002.03.06 |
申请人 |
HEWLETT PACKARD CO <HP> |
发明人 |
BABB SAMUEL M;KOLB LOWELL E;DAVIS BRIAN;MANKIN JONATHAN P;MANN KRISTINA L;MAZURKIEWICZ PAUL H;WAHLEN MARVIN |
分类号 |
H01L23/552;H05K1/02;H05K3/28;H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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