发明名称 Positive photoresist composition
摘要 A positive photoresist composition comprising the components of: (a) a resin which decomposes by the action of an acid, thereby having an increased solubility in an alkali developer; and (b) a compound which is represented by the formula (1) and generates an acid by exposure to active rays or radiation, and a compound which is represented by the formula (2) and generates an acid by exposure to active rays or radiation.
申请公布号 US2002172886(A1) 申请公布日期 2002.11.21
申请号 US20020097983 申请日期 2002.03.15
申请人 FUJI PHOTO FILM CO., LTD. 发明人 MOMOTA MAKOTO;KAWABE YASUMASA
分类号 C08K5/41;C08L101/00;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/004;G03F7/30 主分类号 C08K5/41
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