| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a wiring board of high reliability in which a stable connection state may be firmly maintained over a long period of time in performing surface mounting of a wiring board, such as, a semiconductor element housing package, by soldering onto an external electric circuit board having an insulating board made mainly of an organic resin. SOLUTION: In this structure, a wiring board A which has an insulating board 1, a metallize wiring layer 3 provided on the surface and inner side of the insulating board 1, and a connection terminal 4 mounted on the lower surface of the insulating board 1 and electrically connected with the metallize wiring layer 3, is set on an external electric circuit board B which has a wiring conductor 8 applied on the surface of an insulator 7 containing at least an organic resin. The connection terminal 4 of the wiring board A and the wiring conductor 8 of the external electric circuit board B are soldered for mounting. In this case, the insulating board 1 of the wiring board is made of a sintered body having a Young's modulus not greater than 200GPa at temperatures of -70 deg.C to 200 deg.C. |
