发明名称 Method of manufacturing circuit boards
摘要 A method for manufacturing circuit boards at reduced cost includes the steps of producing a plurality of identical circuit board units on a big base plate at one time, so that each circuit board unit is connected to the base plate only at several connecting joints; conducting a circuit test for each circuit board unit; if any defective circuit board unit is found, using a cutting module to cut the connecting joints between the base plate and the defective circuit board unit and removing the latter to leave a void on the base plate; using a trimming module to trim off the broken connecting joints; using a shearing module to cut a substitute and good circuit board unit from a spare base plate; and moving the substitute circuit board unit into the void on the base plate, and fixing it in place in the void with adhesive.
申请公布号 US6481098(B1) 申请公布日期 2002.11.19
申请号 US20010897990 申请日期 2001.07.05
申请人 LIN CHEN SHOU-CHIH 发明人 LIN CHEN SHOU-CHIH
分类号 H05K3/00;H05K3/22;(IPC1-7):H05K3/30 主分类号 H05K3/00
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