发明名称 Substrate for mounting semiconductor integrated circuit device
摘要 Test terminals connected to output lead sections are divided into blocks, and in each of the blocks, an outermost pair of the test terminals extends inwards from the output lead sections to oppose each other, and the pair is located relatively far from a place where a liquid crystal driver LSI chip is mounted.
申请公布号 US6483042(B2) 申请公布日期 2002.11.19
申请号 US20010983502 申请日期 2001.10.24
申请人 SHARP KABUSHIKI KAISHA 发明人 YAMASHITA TAKESHI
分类号 G02F1/1345;H01L21/60;H01L21/822;H01L23/12;H01L23/32;H01L23/58;H01L27/04;H04N5/66;H05K1/11;(IPC1-7):H05K1/16 主分类号 G02F1/1345
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