Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof

摘要

This invention provides a technique capable of solving a problem of an ununiform plating on an annular edge portion of a surface to be plated of a wafer, which ununiform plating is usually caused due to an ununiform flow of a plating apparatus, thereby ensuring a uniform plating treatment on the entire surface to be plated of a wafer. The present invention is directed to a cup-shaped plating apparatus comprising a wafer support section provided along an upper opening of a plating tank, a plurality of solution-outlet passages provided below the wafer support section and extending from the inside of and to the outside of the plating tank and at least one solution-supply pipe provided through the bottom of the plating tank.