发明名称 Probe card for probing wafers with raised contact elements
摘要 A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
申请公布号 US6483328(B1) 申请公布日期 2002.11.19
申请号 US19980204740 申请日期 1998.12.02
申请人 FORMFACTOR, INC. 发明人 ELDRIDGE BENJAMIN N.;GRUBE GARY W.;MATHIEU GAETAN L.
分类号 G01R31/26;B23K20/00;G01R1/067;G01R1/073;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/60;H01L21/603;H01L21/66;H01L23/48;H01L23/485;H01L23/49;H01L23/498;H01L25/065;H01L25/16;H01R33/76;H05K1/14;H05K3/20;H05K3/32;H05K3/34;H05K3/36;H05K3/40;(IPC1-7):G01R31/26 主分类号 G01R31/26
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