| 摘要 |
<p>An inventive method for producing a transponder module initially comprises the step in which a metallization layer (4) is deposited on a first auxiliary support (100). Afterwards, a circuit chip (6) comprising a first connecting area located on a first main surface of the same and comprising a second connecting area located on a second main surface of the same which is opposite the first main surface is deposited on the metallization layer (4) in such a way that the second connecting area is conductively connected to the metallization layer (4). Next, an insulation layer (2) is produced on the metallization layer (4) such that the circuit chip (6) is surrounded by the insulation layer (2), and the surface of the insulation layer (2) facing away from the metallization layer is flush with the first surface of the circuit chip (6) facing away from the metallization layer. A structured metallization (8) with a first and second connection end (12, 14), said connection end defining an antenna device, is produced on the insulation layer (2) and on the circuit chip (6) such that the first connection end (12) is connected to the first connecting area of the circuit chip (6), whereupon a plated-through contact (16) is produced which passes through said insulation layer (2) in order to conductively connect the second connection end (14) of the structured metallization (8) to the metallization layer (4). Finally, the first auxiliary support (100) is removed.</p> |
