发明名称 POLYIMIDE PRECURSOR SOLUTION
摘要 PURPOSE: Provided is a polyimide precursor solution which comprises a plasticizer for imparting the flexibility to the polyimide precursor solution, weakening an intermolecular force and thus facilitating the motion of molecular chain, and which can reinforce the adhesion of the polyimide. CONSTITUTION: The polyimide precursor solution comprising 65-95 parts by weight of N-methyl pyrroline, 5-35 parts by weight of polyamic acid, 0-15 parts by weight of n-butyl cellosolve, and 0-20 parts by weight of ethyl cellosolve, is characterized by further comprising 0.1-5.0 parts by weight of plasticizer. The plasticizer is selected from the group consisting of dibutylphthalate, n-dioctyl phthalate. The amount of plasticizer is 3 wt%. The solution further comprises a surfactant.
申请公布号 KR100362433(B1) 申请公布日期 2002.11.13
申请号 KR19950066735 申请日期 1995.12.29
申请人 SAMSUNG SDI CO., LTD. 发明人 CHO, SU YEON;LEE, CHAN JAE
分类号 C08G73/10;(IPC1-7):C08G73/10 主分类号 C08G73/10
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