发明名称 Flattening and machining method and apparatus
摘要 With a time control means for a wetting treatment of a fixed abrasive platen provided, the fixed abrasive platen is set in a good wet state in advance prior to the start of polishing. The time control means may be incorporated in the body of a flattening/machining apparatus, or alternatively a wetting retaining mean may newly be separately provided instead. While the fixed abrasive platen is rapidly transformed through expansion due to wetting, the wetting treatment is desirably performed till a transformation ratio thereof is stabilized at 0.0005% or less.
申请公布号 US6477825(B2) 申请公布日期 2002.11.12
申请号 US20020124457 申请日期 2002.04.18
申请人 HITACHI, LTD. 发明人 KATAGIRI SOUICHI;YASUI KAN
分类号 B24B37/04;B24B37/12;B24B53/007;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B37/04
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