发明名称 Method of making memory wordline hard mask extension
摘要 A manufacturing method is provided for an integrated circuit memory with closely spaced wordlines formed by using hard mask extensions. A charge-trapping dielectric material is deposited over a semiconductor substrate and first and second bitlines are formed therein. A wordline material and a hard mask material are deposited over the wordline material. A photoresist material is deposited over the hard mask material and is processed to form a patterned photoresist material. The hard mask material is processed using the patterned photoresist material to form a patterned hard mask material. The patterned photoresist is then removed. A hard mask extension material is deposited over the wordline material and is processed to form a hard mask extension. The wordline material is processed using the patterned hard mask material and the hard mask extension to form a wordline, and the patterned hard mask material and the hard mask extension are then removed.
申请公布号 US6479348(B1) 申请公布日期 2002.11.12
申请号 US20020109516 申请日期 2002.03.27
申请人 ADVANCED MICRO DEVICES, INC.;FUJITSU LIMITED 发明人 KAMAL TAZRIEN;NGO MINH VAN;RAMSBEY MARK T.;SHIELDS JEFFREY;YANG JEAN Y.;LINGUNIS EMMANUIL;SHIRAIWA HIDEHIKO;HUI ANGELA T.
分类号 H01L23/52;H01L21/3205;H01L21/8246;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 主分类号 H01L23/52
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