| 摘要 |
PROBLEM TO BE SOLVED: To prevent coming-off of abrasive grains in cutting work by improving adhesive force of the abrasive grains to a core wire of a resin bond wire saw. SOLUTION: An abrasive grain layer 2 after a bond layer 2a coated on a core wire 1 comprising a piano wire 1a plated with a Cu-Zn alloy is hardened is pressed by a pressure roller till the abrasive grains 2 are partly embedded. The abrasive grains 2b are thus partly biting a plating layer 1b, thereby the abrasive grains will not come off by abrasion or vibration of the bond layer 2a in cutting work by use of the wire saw. |
