发明名称 Method for bonding a flexible substrate to a chip
摘要 Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.
申请公布号 US6478906(B1) 申请公布日期 2002.11.12
申请号 US20000693255 申请日期 2000.10.20
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E. V. 发明人 AZDASHT GHASSEM;ZAKEL ELKE;REICHL HERBERT
分类号 B23K26/00;B23K20/10;H01L21/60;H01L21/603;H05K1/18;H05K3/32;(IPC1-7):B32B31/16 主分类号 B23K26/00
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