| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment and an method for pressure-bonding an electronic component such as a plurality of flip chips on a substrate at a time. SOLUTION: The equipment is provided with a pedestal part 1 having a plurality of pressure-bonding tools 3 for pressure-bonding the electronic component, a plurality of insertion holes being guides 2 capable of simultaneously vertically moving the tools 3 on the substrate, and an elastic body 5 for adjusting the difference between the vertically moved distances of the tools 3. When the electronic components different in thickness are simultaneously pressure-bonded by the equipment, a difference between the strokes of the tool is canceled by the difference between the deformation amounts of the elastic body interposed in the tool, and the batch-process of pressure-bonding of the electronic components can be easily realized.
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